Applied Materials 0021-33621

Product Description

0021-33621 is a Middle Matrix Copper Shield designed for AMAT Endura2 300mm sputtering chambers. It is a cylindrical copper component installed inside the PVD process chamber, engineered to shape plasma and capture sputtered material during metal deposition processes.

Product Functions

• Defines plasma confinement area to achieve uniform copper sputtering on 300mm wafers.
• Traps excess sputtered copper particles to reduce coating buildup on chamber internal hardware.
• Maintains consistent chamber geometry to stabilize thin-film thickness and process repeatability.
• Reduces arcing risk and protects critical chamber parts from plasma bombardment damage.

Application Scenarios

• Applied Materials Endura2 300mm PVD (Physical Vapor Deposition) systems.
• Copper metallization deposition chambers for semiconductor wafer fabrication.
• Logic and memory chip manufacturing fabs with 300mm wafer production lines.

Frequently Asked Issues

• Copper deposition buildup: Thick accumulated films on the shield surface generate particles, leading to wafer defects.
• Plasma erosion: Long-term plasma bombardment causes surface wear, altering plasma distribution and leading to film thickness drift.
• Thermal deformation: Repeated heating and cooling cycles may cause distortion, affecting chamber sealing and process stability.
• Installation misalignment: Offset mounting can trigger arcing, abnormal chamber pressure and inconsistent deposition results.