Applied Materials 0021-16781

Product Description

0021-16781 is an upper shield component (Shield Upper, Rev 2.0 Sip Cu, 300mm) manufactured by Applied Materials for semiconductor wafer processing chambers. It is a copper-based shielding part designed for 300mm wafer platforms, used inside deposition process chambers to define plasma boundaries and protect chamber hardware from unwanted material deposition.

Product Functions

• Forms physical and plasma shielding inside the process chamber during copper deposition.
• Controls plasma distribution to ensure uniform thin-film deposition on 300mm silicon wafers.
• Reduces sputter deposition on inner chamber walls and protects other chamber components.
• Maintains stable chamber geometry to preserve process repeatability and wafer yield.

Application Scenarios

• Applied Materials Endura / Centura 300mm semiconductor processing platforms.
• Copper SIP deposition chambers for advanced wafer metallization processes.
• Semiconductor fabs for logic and memory chip manufacturing.

Frequently Asked Issues

• Surface particle contamination: Copper shield surface accumulates deposits, causing wafer defects; requires periodic cleaning or replacement.
• Physical erosion: Long-term plasma bombardment leads to shield wear, degrading plasma uniformity.
• Deformation: Thermal cycling may cause warping, altering chamber spacing and process drift.
• Improper installation: Misalignment causes arcing, chamber leaks or inconsistent deposition results.