Applied Materials 0021-03721 200MM XE Reflector Plate

Product Description

The 0021-03721 is a precision reflector plate manufactured by Applied Materials for 200mm RTP XE rapid thermal processing vacuum chambers. It is a large flat high-temperature alloy plate with special reflective surface coating, designed to be installed below the RTP lamp array. It reflects infrared radiation from heating lamps back toward the wafer plane to improve thermal uniformity. The component can withstand high temperature cycling and vacuum environment, with low particle emission and high thermal stability for 8-inch wafer annealing processes. Available inventory includes cleaned used and refurbished reflector plates for semiconductor fab chamber maintenance and rebuild projects.

Product Functions

• Reflect infrared radiant heat from tungsten halogen lamp array upward to the backside of 200mm silicon wafer.
• Optimize spatial thermal distribution across wafer surface, reducing hot spots and improving temperature mapping uniformity during rapid thermal annealing.
• Withstand repeated fast heating and cooling cycles under high vacuum without thermal deformation or coating delamination.
• Block excess radiant heat from entering lower chamber hardware, protecting sensors and rotary bearing assembly from overheating.
• Maintain stable reflectivity over long production runs to guarantee repeatable wafer temperature and recipe consistency.
• Precision mounting features ensure flat and parallel installation relative to wafer plane.
• Modular plate design supports disassembly, surface cleaning and coating inspection during chamber PM cycles.

Application Scenarios

• 200mm RTP XE rapid thermal processing chambers for 8-inch wafer semiconductor manufacturing.
• Source/drain activation, silicide formation, thin film stress adjustment and oxide annealing processes.
• Spare replacement for degraded, discolored or coating-damaged 0021-03721 reflector plates in production RTP tools.
• Chamber overhaul, lamp array replacement and thermal system requalification projects in 200mm wafer fabs.
• Process recipe tuning and temperature mapping optimization after reflector replacement.
• Spare parts inventory for semiconductor equipment service vendors and wafer manufacturing factories.

Common Problems

• Reflective coating degradation: high-temperature radiation causes darkening, reducing reflectivity and leading to wafer temperature drift.
• Surface contamination: process by-product deposits adhere to reflector surface, altering heat reflection profile and film non-uniformity.
• Thermal warping: repeated rapid thermal cycling causes plate bending, breaking parallelism with wafer and creating localized hot zones.
• Particle contamination: coating peeling or surface oxidation generates particles that cause wafer yield loss.
• Mounting distortion: uneven fastener torque or fatigue deformation leading to tilted reflector installation.
• Hot spot generation: local coating loss creates uneven reflection, triggering wafer temperature non-uniformity and process drift.
• Refurbished unit risk: residual coating wear; reflectivity mapping, flatness inspection and particle check required before installation to production chamber.