Applied Materials 0021-42136

Product Description

0021-42136 is a chamber shield component for Applied Materials 300mm PVD sputtering system. It is a precision metal shielding part installed inside the physical vapor deposition chamber, designed to constrain plasma and capture sputtered metal material during wafer metallization processes.

Product Functions

• Confines plasma within the target processing zone to ensure uniform thin-film deposition on 300mm silicon wafers.
• Catches excess sputtered metal particles to reduce material buildup on chamber walls and other internal hardware.
• Maintains fixed chamber geometry to guarantee stable process parameters and consistent wafer yield.
• Minimizes plasma arcing and protects chamber structural components from ion bombardment damage.

Application Scenarios

• Applied Materials Endura series 300mm PVD semiconductor deposition platforms.
• Metal sputtering chambers for wafer copper or aluminum metallization processes.
• Front-end wafer fabrication fabs for logic and memory chip production.

Frequently Asked Issues

• Particle contamination: Accumulated metal deposits flake off and generate particles, causing wafer surface defects.
• Plasma erosion: Long-term ion bombardment wears down the shield surface, changing plasma distribution and leading to film thickness drift.
• Thermal distortion: Repeated high-temperature cycling causes warping, affecting chamber spacing and process repeatability.
• Installation error: Improper mounting alignment may trigger arcing, chamber pressure fluctuation and non-uniform deposition.