Applied Materials 0022-15836

Product Description

0022-15836 is a LowK Xtra Row Extending Faceplate for Applied Materials 300mm semiconductor dielectric etching chamber. It is a precision engineered chamber faceplate, mounted between gas delivery assembly and plasma reaction zone, used for low-k dielectric etch process on 300mm silicon wafers.

Product Functions

• Distributes process gas uniformly across wafer surface through precision orifice array.
• Forms the upper boundary of plasma reaction zone to stabilize plasma shape and density during low-k etch.
• Maintains consistent gas flow velocity and pressure to guarantee uniform etch rate across entire wafer.
• Resists plasma chemical corrosion and ion bombardment, protects upstream gas supply components.

Application Scenarios

• Applied Materials 300mm dielectric etch platform for low-k interconnect etch process.
• Front-end semiconductor fab for advanced logic chip manufacturing.
• Low-k material etching chamber for copper interconnect patterning.

Frequently Asked Issues

• Orifice clogging: Polymer byproducts deposit inside small holes, causing uneven gas distribution and etch non-uniformity.
• Plasma erosion: Long-term ion bombardment widens orifice size, leading to process drift and poor CD control.
• Surface particle flaking: Built-up polymer layers peel off and create particles, resulting in wafer defects.
• Seal leakage: Thermal cycling may damage sealing surface, causing chamber vacuum leak and process instability.