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Applied Materials 0190-32884
- Warehouse: Spot
- Warranty: 365 days
- Quality: Original module
- Condition: New
- Shipping method: Courier delivery
- Contact person: LI MING
- Contact number: +86 18059884790
- WeChat:18059884790
- E-mail: plc66@qq.com
Product Description
Applied Materials 0190-32884
Product Description
0190-32884 is an 8-channel pyrometer / EM sensor hub interface assembly (IFM8-915, Exactus) for Applied Materials semiconductor RTP and thermal processing chambers. It is a dedicated signal acquisition hub board that connects multiple optical pyrometer sensors, converting weak infrared radiation signals from the wafer surface into conditioned digital data for high-precision wafer temperature measurement during rapid thermal processing.

Product Functions
- Simultaneously acquires signals from up to 8 pyrometer channels to capture multi-point wafer surface temperature readings.
- Performs signal amplification, filtering and noise suppression for low-level optical sensor signals, resisting plasma and thermal electromagnetic interference.
- Transmits calibrated temperature measurement data to the chamber controller for closed-loop lamp power regulation and wafer thermal uniformity control.
- Supports sensor health diagnosis, over-temperature interlock triggering and fault alarm reporting for thermal chamber protection.
Application Scenarios
- Applied Materials RTP rapid thermal processing platforms for 300mm semiconductor wafers.
- Thermal annealing, dopant activation and thin-film thermal treatment vacuum chambers.
- Semiconductor fabs requiring non-contact, high-precision optical temperature monitoring of wafers.
Frequently Asked Issues
- Temperature reading drift: Aging signal conditioning circuits or contaminated pyrometer optical path cause measurement offset and poor wafer thermal uniformity.
- Channel dropout fault: Connector degradation or optical sensor failure results in loss of individual pyrometer channel readings and recipe abort.
- ESD damage: Improper electrostatic protection during handling burns weak-signal amplifier and ADC circuits on PCB.
- Contamination: Deposition byproducts on optical window and circuit traces cause signal attenuation and unstable temperature sampling.
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