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Applied Materials 0190-32884
  • Warehouse: Spot
  • Warranty: 365 days
  • Quality: Original module
  • Condition: New
  • Shipping method: Courier delivery

  • Contact person: LI MING
  • Contact number: +86 18059884790
  • WeChat:18059884790
  • E-mail: plc66@qq.com

Product Description

Applied Materials 0190-32884

Product Description

0190-32884 is an 8-channel pyrometer / EM sensor hub interface assembly (IFM8-915, Exactus) for Applied Materials semiconductor RTP and thermal processing chambers. It is a dedicated signal acquisition hub board that connects multiple optical pyrometer sensors, converting weak infrared radiation signals from the wafer surface into conditioned digital data for high-precision wafer temperature measurement during rapid thermal processing.

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Product Functions

  • Simultaneously acquires signals from up to 8 pyrometer channels to capture multi-point wafer surface temperature readings.
  • Performs signal amplification, filtering and noise suppression for low-level optical sensor signals, resisting plasma and thermal electromagnetic interference.
  • Transmits calibrated temperature measurement data to the chamber controller for closed-loop lamp power regulation and wafer thermal uniformity control.
  • Supports sensor health diagnosis, over-temperature interlock triggering and fault alarm reporting for thermal chamber protection.

Application Scenarios

  • Applied Materials RTP rapid thermal processing platforms for 300mm semiconductor wafers.
  • Thermal annealing, dopant activation and thin-film thermal treatment vacuum chambers.
  • Semiconductor fabs requiring non-contact, high-precision optical temperature monitoring of wafers.

Frequently Asked Issues

  • Temperature reading drift: Aging signal conditioning circuits or contaminated pyrometer optical path cause measurement offset and poor wafer thermal uniformity.
  • Channel dropout fault: Connector degradation or optical sensor failure results in loss of individual pyrometer channel readings and recipe abort.
  • ESD damage: Improper electrostatic protection during handling burns weak-signal amplifier and ADC circuits on PCB.
  • Contamination: Deposition byproducts on optical window and circuit traces cause signal attenuation and unstable temperature sampling.


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