Applied Materials 0041-35140

Product Description

0041-35140 is a reflector plate assembly for Applied Materials Radiance RTP (Rapid Thermal Processing) chamber, designed for 300mm wafer rapid thermal annealing. It is a precision high-temperature optical reflector component, coated with high-reflectivity material, mounted inside the thermal processing chamber to manipulate infrared light path under vacuum and high-temperature operating conditions.

Product Functions

• Reflect infrared radiant energy from heating lamps to achieve uniform temperature distribution across 300mm wafer surface.
• Optimize IR light path to support spike anneal, dopant activation and thermal oxidation processes with tight temperature control.
• Minimize heat loss inside chamber to improve thermal efficiency and recipe repeatability.
• Withstand repeated rapid thermal cycling and vacuum environment without losing optical performance quickly.

Application Scenarios

• Applied Materials Radiance series RTP systems for 300mm wafer fabrication.
• Semiconductor front-end fab for ion implantation annealing and advanced thermal treatment.
• Logic and memory chip manufacturing requiring ultra-fast high-temperature spike annealing.

Frequently Asked Issues

• Reflectivity degradation: Long time high-temperature exposure causes coating discoloration, leading to wafer temperature non-uniformity and recipe drift.
• Thermal warpage: Rapid heating and cooling cycles induce plate deformation and change infrared reflection geometry.
• Particle generation: Process byproducts accumulate and peel off, creating particles that cause wafer defects.
• Coating delamination: Thermal stress leads to reflective coating peeling, requiring component replacement.