Applied Materials 0041-32713

Product Description

0041-32713 is a high-temperature reflector assembly component for Applied Materials RTP (Rapid Thermal Processing) chamber. This precision machined reflector plate is installed inside the Radiance thermal processing chamber, made of high-purity refractory coated material, designed for 300mm wafer rapid thermal annealing under vacuum environment.

Product Functions

• Reflect infrared radiant energy from heating lamps to achieve uniform temperature distribution across the entire 300mm wafer surface.
• Maintain stable thermal boundary to reduce heat loss and guarantee precise temperature control during spike anneal processes.
• Work together with temperature sensing system to ensure repeatable thermal recipe execution for wafer dopant activation.
• Withstand cyclic high temperature and thermal shock in vacuum environment, maintaining stable reflectivity over production cycles.

Application Scenarios

• Applied Materials Radiance series RTP rapid thermal processing system for 300mm wafers.
• Semiconductor front-end fab for ion implantation annealing and thermal activation processes.
• Advanced logic and memory chip manufacturing requiring ultra-short high-temperature spike annealing.

Frequently Asked Issues

• Reflectivity degradation: Long-term high temperature exposure causes coating discoloration, leading to wafer temperature non-uniformity and recipe drift.
• Thermal deformation: Repeated rapid heating and cooling cycles induce plate warpage, changing IR reflection path.
• Surface particle contamination: Process byproducts deposit on reflector surface, flaking off and creating wafer killer defects.
• Coating peeling: Thermal stress causes the reflective coating to delaminate, requiring part replacement.