Applied Materials 0041-36731

Product Description

0041-36731 is a high-temperature reflector assembly for Applied Materials Radiance RTP (Rapid Thermal Processing) chamber, compatible with 300mm wafer thermal processing platform. It is precision-manufactured high reflectivity optical component, installed inside vacuum thermal chamber, designed for spike anneal and rapid thermal activation processes.

Product Functions

• Reflect infrared radiation from heating lamps to deliver uniform thermal distribution across the entire 300mm wafer surface.
• Shape infrared light path to achieve tight and repeatable temperature control during ultra-fast spike annealing.
• Reduce heat loss inside chamber, improve thermal efficiency and stabilize thermal recipe performance.
• Resist thermal shock and vacuum environment cycling, maintain optical reflectivity over production runs.

Application Scenarios

• Applied Materials Radiance series RTP rapid thermal processing system for 300mm wafers.
• Semiconductor front-end fab for ion implantation dopant activation and thermal annealing.
• Advanced logic and memory chip manufacturing requiring precise short-time high-temperature thermal treatment.

Frequently Asked Issues

• Reflectivity degradation: Long-term high temperature exposure causes coating discoloration, resulting in wafer temperature non-uniformity and recipe drift.
• Thermal warpage: Repeated rapid heating and cooling cycles induce plate deformation and alter infrared reflection geometry.
• Particle contamination: Deposited process byproducts flake off and create particles which cause wafer surface defects.
• Coating delamination: Thermal stress causes the reflective layer to peel, requiring replacement of the reflector assembly.