Applied Materials 0010-25739 HY11 Magnet Assembly, DS-TTN 300mm

Product Description

The 0010-25739 is a HY11 magnet assembly (DS-TTN, 300mm) manufactured by Applied Materials for 300mm PVD physical vapor deposition process chambers. This integrated assembly consists of high-purity permanent magnet blocks, precision mechanical frame, cooling channel structure and mounting hardware. It is installed above the sputtering target inside the vacuum chamber to generate uniform magnetic field for magnetron sputtering. The magnetic field confines plasma electrons near the target surface, improving sputtering efficiency and film uniformity for 300mm silicon wafer metallization. Available stock includes surplus and refurbished magnet assemblies for semiconductor fab chamber maintenance and rebuild projects.

Product Functions

• Generate precise closed-loop magnetic field above the sputtering target to trap electrons and enhance plasma density for magnetron sputtering
• Optimize target erosion profile to achieve uniform thin-film deposition across the full 300mm wafer surface
• Built-in cooling structure to dissipate heat generated by plasma radiation and prevent magnet demagnetization under high-temperature operation
• Modular mechanical mounting frame for accurate positioning and alignment inside the AMAT PVD vacuum chamber
• Maintain stable magnetic field strength over long production cycles to guarantee consistent film thickness and material properties
• Reduce target consumption rate and extend target service life by controlling plasma distribution
• Support recipe-linked process tuning, linking with chamber controller for production run qualification and monitoring

Application Scenarios

• 300mm wafer metal PVD deposition chambers using Applied Materials HY11 DS-TTN platform
• Copper, aluminum and barrier layer sputtering processes for advanced semiconductor metallization
• Spare replacement for degraded or damaged 0010-25739 magnet assemblies in production PVD chambers
• Chamber overhaul, target kit replacement and preventive maintenance projects in 300mm wafer fabs
• Process qualification and recipe tuning for thin-film uniformity optimization
• Spare inventory for semiconductor equipment service vendors and wafer fabrication factories

Common Problems

• Magnetic field decay: magnet demagnetization caused by long-term high temperature exposure and plasma thermal radiation
• Poor film uniformity: magnet offset, mechanical misalignment or uneven magnetic strength across assembly
• Cooling circuit leakage: seal aging, causing water leakage risk inside vacuum chamber and tool downtime
• Particle contamination: peeling protective coating on magnet assembly, introducing particles and reducing wafer yield
• Mechanical deformation: thermal expansion induced frame warping, leading to gap variation between magnet and target
• Target abnormal erosion: asymmetric magnetic field distribution resulting in localized deep target grooving and premature target replacement
• Refurbished unit risk: residual magnetic attenuation; magnetic mapping and field uniformity test required before chamber installation