Applied Materials 0920-00013 MKS ASTeX ASTRON 2L Remote Plasma Source (RPS)

Product Description

0920-00013 is Applied Materials part number for MKS ASTeX ASTRON 2L remote plasma source (RPS), model FI20620-1. It is a remote plasma generator module for AMAT semiconductor processing chambers. This unit generates high-density remote plasma to activate process gases, commonly used for chamber cleaning, ashing, and surface treatment in CVD, PVD or etch tools. It is a high-value OEM sub-assembly integrated into Applied Materials wafer processing platforms.

Key Functions

• Remote Plasma Source (RPS) ASTRON 2L, manufactured by MKS ASTeX for AMAT semiconductor tools
• Generates high-density downstream plasma to dissociate fluorinated cleaning gases (NF3, CF4 etc.) for chamber dry cleaning
• Plasma is generated outside the process chamber, reducing ion bombardment damage to wafer and chamber internal components
• Integrated RF power head, gas inlet port, plasma torch and temperature / pressure monitoring sensors
• Controlled via tool host communication interface; built-in interlock protection for gas flow, temperature, vacuum and RF fault
• Supports continuous operation for wafer chamber clean cycles, removes process polymer and silicon oxide deposits
• Plasma power range up to ~2000W, compatible with 200mm semiconductor wafer processing systems

Application Scenarios

• Applied Materials semiconductor wafer fabrication tools, remote chamber dry clean
• CVD, PVD and etch process chamber cleaning; photoresist ashing and surface modification
• Semiconductor fab production maintenance, spare part replacement for installed ASTRON 2L RPS units
• Used for processing 200mm silicon wafers in fabs for memory, power and logic chip manufacturing

Common Issues & FAQ

• Failure to ignite plasma / no plasma strike: Check gas supply pressure and flow controller; inspect torch tube for erosion or coating buildup; verify RF power supply and cable connections; check vacuum integrity and leak rate.
• Plasma unstable / intermittent extinguish: Inspect torch quartz liner for deposition or cracking; check gas mixture purity; verify cooling water flow and temperature of RPS body; check RF matching network tuning status.
• High chamber particle counts after clean cycle: Quartz liner erosion will release particles; inspect inner surface for etching degradation; replace consumable torch liner as required by maintenance schedule.
• Interlock fault alarm: Check coolant temperature, gas pressure, door interlock and vacuum interlock signals; inspect pressure transducers and temperature sensors on RPS assembly.
• Refurbished / replacement unit note: After installation, perform gas leak test, RF power tuning, plasma ignition test and full chamber clean recipe validation. Check quartz liner condition, o-rings and coolant circuit. Validate tool communication and all safety interlock functions before returning the wafer tool to production operation.