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YASKAWA
Yaskawa XU‑RC350S‑J01 Wafer Transfer Robot (AMAT PN:0190‑43397)
  • Warehouse: Spot
  • Warranty: 365 days
  • Quality: Original module
  • Condition: New
  • Shipping method: Courier delivery

  • Contact person: LI MING
  • Contact number: +86 18059884790
  • WeChat:18059884790
  • E-mail: plc66@qq.com

Product Description

Yaskawa XU‑RC350S‑J01 Wafer Transfer Robot (AMAT PN:0190‑43397)

Product Description

XU‑RC350S‑J01 is Yaskawa dual‑arm atmospheric wafer transfer manipulator, OEM part number 0190‑43397 for Applied Materials Centura / Endura cluster tools. It is a 4‑axis clean‑room robot, including rotation, Z‑axis lift and two independent extend arms, designed for 200 mm wafer handling inside semiconductor fab. This complete robot assembly includes mechanical arm body, built‑in servo motors, encoder units, internal wiring harness and local control PCB. Matched with ERCR‑NS01‑B004‑E1 robot controller to perform wafer cassette‑to‑load‑lock, load‑lock‑to‑process‑chamber high‑precision wafer transfer operation in clean‑room environment. Gross weight approx 36.95 kg.

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Key Functions

  • 4‑axis coordinated motion: theta rotation, Z vertical lift, dual independent telescopic arms for 200 mm wafer pick‑and‑place
  • Clean‑room optimized mechanical design, low particle generation for semiconductor production environment
  • High‑resolution optical encoder position feedback, repeat positioning accuracy within ±0.05 mm
  • On‑board wafer presence optical sensor signal acquisition, wafer edge offset detection
  • Built‑in hardware safety: over‑torque monitoring, collision detection, E‑stop interlock chain
  • Communicate with external ERCR‑NS01 series controller; receive motion recipes, feed back axis position, speed and fault status to AMAT tool host
  • Smooth jerk‑limited trajectory control to avoid wafer slipping or chipping during high‑speed transfer cycles

Application Scenarios

  • Applied Materials Centura, Endura cluster semiconductor processing platforms
  • PVD, CVD, Etch, RTP process module wafer handling subsystem
  • ATM (atmospheric) side cassette and load‑lock wafer transfer
  • 200 mm wafer clean‑room high‑volume manufacturing production line

Common Issues & FAQ

  • Wafer slip / mis‑pick / drop wafer: Check end‑effector finger wear; verify wafer presence sensor calibration; inspect arm joint gear backlash; tune acceleration‑deceleration motion profile parameters.
  • Collision detection fault alarm: Check mechanical obstruction inside robot travel range; verify torque threshold settings; inspect arm mechanical deformation and cable harness drag‑chain damage.
  • Axis homing failure / position drift: Inspect encoder cables and connector pins; check servo motor brake function; execute robot full home‑position calibration sequence via controller service menu.
  • Excessive particle count: Inspect gear grease aging, drag‑chain abrasion; perform clean‑room wipe and re‑grease maintenance according to Yaskawa service manual.
  • Communication loss between manipulator and controller: Check motor/signal cable continuity, connector locking status; inspect ERCR‑NS01 controller power and firmware version compatibility.
  • Refurbished / used unit note: After replacement, complete axis homing, repeat‑accuracy test, continuous cyclic wafer transfer test, interlock safety validation before releasing to production. Inspect arm mechanical structure for prior impact damage before installation.


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