Applied Materials 0041-06016

Product Description

0041-06016 is an RF Feedthrough component for Applied Materials Producer SE platform, used in MFA RF match assembly. It is a high-voltage vacuum feedthrough that transmits RF power into the process chamber while maintaining vacuum integrity, specially designed for plasma process of semiconductor wafer fabrication.

Product Functions

• Delivers high-frequency RF power from RF matching network into vacuum process chamber.
• Maintains hermetic vacuum seal between atmospheric side and high-vacuum chamber interior.
• Isolates high RF voltage to prevent leakage and arcing between power circuit and chamber body.
• Provides impedance matching path to stabilize plasma excitation for thin film deposition or etching processes.

Application Scenarios

• Applied Materials Producer SE semiconductor processing system.
• MFA RF matching assembly for CVD or Etch plasma chambers.
• Semiconductor fabs for 200mm wafer thin-film deposition and etch production.

Frequently Asked Issues

• Vacuum leakage: Degradation of sealing insulator causes chamber pressure rise and process interruption.
• RF arcing: Contamination or insulator aging triggers sparking, damaging RF power supply and chamber hardware.
• Insulator contamination: Process byproducts deposit on ceramic surface, increasing leakage current and unstable plasma.
• Mechanical crack: Thermal stress from repeated heating/cooling leads to ceramic fracture and component failure.