Applied Materials 0020-39360 Upper Bearing Race, RTP XE Chamber

Product Description

The 0020-39360 is an upper bearing race component manufactured by Applied Materials for RTP XE rapid thermal processing semiconductor chambers. This precision-machined annular race forms the upper rolling surface for the rotation bearing assembly, paired with matching lower race 0020-39361. Fabricated from high-temperature resistant alloy with precision surface finishing, it supports the rotating wafer pedestal under high heat and vacuum conditions during rapid thermal annealing processes. It maintains tight geometric tolerances to ensure smooth, low-wobble wafer rotation for uniform thermal treatment across wafer surface. Available inventory includes cleaned used and refurbished races for wafer fab chamber maintenance and rebuild projects.

Product Functions

• Provide precision upper raceway surface for ball bearings to support and guide rotating wafer pedestal inside RTP XE chamber.
• Maintain stable mechanical alignment and low runout during high-temperature wafer rotation for uniform thermal distribution.
• Withstand repeated rapid thermal cycling and vacuum environment without permanent deformation or surface degradation.
• Work together with lower bearing race (0020-39361) to form complete rotary bearing assembly for susceptor rotation.
• Preserve consistent rotational flatness to prevent wafer tilt and temperature mapping deviation during RTP annealing recipes.
• High hardness surface finish minimizes bearing wear and reduces particle generation in cleanroom vacuum chamber.
• Modular component design allows disassembly and replacement during chamber preventive maintenance cycles.

Application Scenarios

• RTP XE rapid thermal processing chambers on Applied Materials semiconductor platforms for 200mm and 300mm wafer thermal annealing.
• Source/drain activation, silicide formation and thin film stress tuning processes for CMOS semiconductor manufacturing.
• Spare replacement for worn, scratched or deformed 0020-39360 upper bearing races causing rotation wobble or temperature non-uniformity.
• Chamber overhaul, rotary subsystem rebuild and preventive maintenance projects in wafer fabrication fabs.
• Recipe requalification and temperature mapping after bearing race replacement to verify thermal uniformity.
• Spare parts inventory for semiconductor equipment service vendors and wafer manufacturing factories.

Common Problems

• Race surface scratching and denting: bearing ball wear and contamination particles scoring the precision raceway, increasing rotation wobble.
• Thermal deformation: repeated rapid heating/cooling cycles causing race warping, leading to pedestal tilt and poor wafer temperature uniformity.
• Particle contamination: metal debris generated from bearing/race friction, introducing yield-killing particles onto wafer surface.
• Dimensional tolerance drift: surface material fatigue over long runtime, changing race profile and increasing rotational runout.
• Seal and interface fouling: process by-product deposits accumulating around race assembly, binding rotation movement.
• Premature bearing failure: damaged race surface accelerates ball bearing wear and shortens rotary subsystem service life.
• Refurbished unit risk: residual surface scratches; full dimensional inspection, surface metrology and spin test required before chamber installation.