0190‑41326 Applied Materials Remote Plasma Source Generator (RPS)

Product Description

0190‑41326 is a remote plasma source generator manufactured by MKS for Applied Materials semiconductor process equipment. This water‑cooled plasma unit adopts 3‑phase 208V AC power input, and it is a key component of CVD and etch chamber cleaning systems. It generates high‑energy reactive radicals outside the vacuum chamber and delivers them into the process chamber. Built with marine‑grade cooling circuits and integrated RS‑232 / custom I/O control interfaces, it is optimized for continuous long‑time operation inside wafer fabrication tools and meets strict semiconductor fab cleanliness and reliability standards.

Product Functions

• Generate remote high‑density plasma and produce reactive free radicals for dry chamber cleaning
• Remove polymer and dielectric by‑products deposited on chamber walls and internal components
• Receive operation recipes and control commands via serial communication and discrete I/O signals
• Real‑time monitoring of plasma status, cooling water flow, temperature and internal fault conditions
• Send working state and alarm feedback to the semiconductor tool mainframe controller

• Reduce in‑chamber plasma damage to wafers and extend the service life of process hardware

  
  

Application Scenarios

• CVD deposition chamber in 200mm/300mm wafer fabrication equipment
• Plasma etcher dry cleaning and residue removal processes
• Flat‑panel display and solar cell thin‑film production systems
• Semiconductor factory high‑vacuum process chamber maintenance cycles
• Applied Materials Centura and Endura platform process modules

Common Problems

• Failed plasma ignition: Insufficient process gas flow, contaminated plasma chamber, aging RF coil or unstable three‑phase power supply.
• Over‑temperature alarm: Blocked cooling water pipeline, water flow shortage, scaling inside heat exchanger or poor thermal contact.
• Communication loss with tool controller: Damaged RS‑232 cable, loose I/O terminal connectors or incorrect serial parameter settings.
• Weak cleaning efficiency: Eroded plasma tube, radical recombination, gas leakage at sealing joints or contaminated injector nozzle.
• Intermittent system shutdown: Internal component thermal drift, coolant pressure fluctuation or arc discharge inside the plasma cavity.