MKS ASTeX AX8407A / 0190‑17159 Semiconductor Ozone Generator

Product Description

The AX8407A (Applied Materials part number 0190‑17159) is a high‑concentration, rack‑mounted ozone generator manufactured by MKS ASTeX for semiconductor wafer processing equipment. It uses electric discharge technology to convert oxygen feed gas into high‑purity ozone. Equipped with integrated water cooling, local HMI control panel and digital communication interface, this unit is a factory‑qualified OEM component for AMAT thin‑film deposition tools. It provides stable, controllable O3 concentration for oxidation and cleaning processes under strict cleanroom conditions.

Product Functions

• Generate high‑purity ozone gas from incoming oxygen by corona discharge
• Precise ozone concentration and gas flow closed‑loop regulation for consistent process recipes
• Built‑in water cooling system to stabilize discharge temperature and prevent overheating
• Local keypad and digital display for setpoint adjustment, status reading and alarm checking
• Digital communication link to host semiconductor tool controller for recipe synchronization
• Comprehensive safety interlocks: over‑temperature, gas leak, cooling loss and abnormal discharge protection
• Internal fault logging to record alarms and operating data for maintenance analysis

Application Scenarios

• Applied Materials semiconductor thin‑film deposition and thermal oxidation chambers
• Ozone‑assisted CVD, ALD and high‑k dielectric wafer manufacturing processes
• Photoresist ashing and dry cleaning for 200mm / 300mm silicon wafers
• Front‑end wafer fab cleanroom process skids and OEM process modules
• Flat‑panel display and compound semiconductor production equipment
• Replacement spare unit for AMAT original 0190‑17159 ozone generator assemblies

Common Problems

• Low or unstable ozone output：discharge tube aging, oxygen feed pressure fluctuation or cooling water fouling
• Over‑temperature fault alarm：cooling water flow reduction, blocked water channel or heat exchanger scaling
• Communication failure with host tool：cable damage, connector oxidation or protocol mismatch
• No ozone generation：discharge power supply failure, broken electrode or interlock safety shutdown
• Frequent safety interlock trip：gas leakage, abnormal inlet gas purity or sensor drift
• Intermittent concentration drift：internal contamination, electrode degradation or unstable operating temperature
• Display or keypad unresponsive：front‑panel membrane wear, loose internal flat cable