1. Product Description

716-443090-002 is a specialized precision hardware component exclusively designed for LAM Research semiconductor etching equipment. Manufactured with ultra-clean industrial-grade materials, it features high corrosion resistance, dimensional precision tolerance and vacuum environment adaptability. This component undergoes strict semiconductor factory-level cleaning and surface passivation treatment to avoid particle contamination during wafer processing, fully matching the ultra-high cleanliness requirements of chip manufacturing process chambers.

2. Core Product Functions

• Structural positioning support inside plasma etching reaction chamber
• Isolate and shield plasma chemical corrosion to protect core chamber assemblies
• Stable airflow distribution for process gas circulation on wafer surface
• Maintain consistent thermal conduction balance under high-temperature etching conditions
• Reduce micro-particle generation to guarantee wafer yield rate

• Standard modular assembly for quick disassembly and equipment maintenance

3. Application Scenarios

• Semiconductor wafer plasma etching process equipment from LAM Research
• Front-end fabrication chamber of 28nm to 3nm advanced chip production lines
• Logic chip, memory chip and power semiconductor manufacturing workshops
• Ultra-high vacuum cleanroom processing equipment
• RF plasma reaction chamber core internal structural assemblies

• Mass production semiconductor fab equipment spare part replacement

4. Common Problems & Troubleshooting