Product Number:LAM 0010-32695 semiconductor materials

Product Overview

AM 0010-32695 Overview of Semiconductor Materials

LAM 0010-32695 is a high-performance semiconductor manufacturing material developed by Lam Research. It is mainly applied in advanced wafer manufacturing processes, such as etching and thin film deposition of logic chips and memory chips. As a leading enterprise in the global semiconductor equipment and materials field, Lam Research's material products are usually deeply integrated with equipment technology, aiming to enhance process accuracy, yield and production efficiency.

Core features and technical advantages

Material composition and structure

It is speculated to be a composite semiconductor material, possibly containing silicon (Si), gallium nitride (GaN), silicon carbide (SiC), or metal-organic compounds, etc., synthesized through special processes to meet the requirements of nanoscale manufacturing processes.

It features high purity (impurity content below the ppm level) and uniformity, ensuring atomic-level precision control during the thin film deposition or etching process.

Process adaptability

Plasma etching equipment (such as Kiyo™, Sigma™ series) and thin film deposition equipment (such as Altus™, Sentura™ series) suitable for Lam Research can be used as target or precursor materials in advanced processes such as extreme ultraviolet (EUV) lithography and atomic layer deposition (ALD).

Support the manufacturing of high aspect ratio structures (such as 3D NAND stacking, FinFET transistors), and reduce the damage to the substrate by optimizing the Etch Selectivity of the material.

Performance

Low defect rate: The material production process undergoes multiple purification and testing to reduce the risk of particle contamination or chemical residues on the wafer surface.

Environmental tolerance: It can remain stable under extreme process conditions such as high temperature (>1000℃) and plasma bombardment, and is suitable for complex processes such as Dry Etching and chemical vapor deposition (CVD).

Sustainability: Green chemical processes may be adopted to reduce the emission of harmful by-products, which is in line with the low-carbon trend of the semiconductor industry.

Application scenarios

Logic chips: They are used in the manufacturing of key structures such as transistor gates and metal interconnect layers for 7nm and below processes, enhancing the integration and performance of the chips.

Storage chips: Support the high stacking layer count of 3D NAND flash memory (such as over 500 layers) and the miniaturization of DRAM storage cells to enhance storage density and read/write speed.

Power devices: As an epitaxial layer material in GaN/SiC power semiconductors, it optimizes the breakdown voltage and switching efficiency of the devices, and is suitable for fields such as electric vehicles and 5G base stations.

Supply chain and Compliance

Subject to the export control policies of the United States, the supply of advanced semiconductor materials such as LAM 0010-32695 to China may involve technology licensing restrictions and compliance needs to be confirmed through the official channels of Lam Research.

Lam Research typically establishes long-term partnerships with global wafer fabrication plants such as TSMC, Samsung, and Intel, and its material supply needs to match the process nodes and capacity planning of its clients.

LAM 0010-32695 semiconductor materials

This article is originally written by KIMI Xiaoming. Please bring the link www.xbplcdcs.com when reprinting

Client Concern

Part Number : LAM 0010-32695 semiconductor materials

Condition : Brand New with 12 month warranty

Lead Time : in stock

Status: 100% original

Payment method: T/T. Currencies for receipt: US dollar, New Zealand dollar, Chinese yuan, euro, Hong Kong dollar, Australian dollar, British pound, Canadian dollar, ruble and other global currencies

Sales Manager: Li Ming

WeChat: 18059884790

WHATSAPP:+86 18059884790 

Click to add 【WHATSAPP】 and start a new experience of instant communication         

Email:plc66@qq.com

LAM 0010-32695 semiconductor materials  Not what you want? 

Company Profile: Lam Research is a leading global supplier of innovative wafer manufacturing equipment and services for the semiconductor industry, with its headquarters located in Fremont, California, USA. Founded in 1980 by David K. Lam who was born in China, it was listed on the NASDAQ in the United States in 1984, with the stock code NASDAQ:LRCX. The current president is Tim Archer.

Development history: The first plasma etching machine product, AutoEtch, was launched in 1981. The first ICP dry etching equipment was developed in 1992. In 1997, it acquired the chip equipment manufacturer OnTrak Systems Inc. In 2006, Bullen Semiconductor (i.e. Silfex, Inc.) was acquired. Entered the field of atomic layer etching in 2014. A technical training center was established in Beijing in January 2019. In January 2023, layoffs were announced due to the slowdown in chip demand and export control regulations.

Business scope: We offer thin-film deposition, plasma etching, photoresist stripping and wafer cleaning services. Our products are mainly used in front-end wafer processing and also provide equipment for back-end wafer-level packaging and related manufacturing markets.

Technology and Products

Semiverse solutions: including SEMulator 3D and OverViz. SEMulator 3D is a semiconductor process modeling platform that can "virtually manufacture" advanced nanofabrication processes. OverViz is an industrial simulation software platform for high-fidelity plasma discharge modeling.

Low-temperature etching technology: It can use new chemical substances to enhance high aspect ratio etching capabilities, increase etching rates, achieve vertical high aspect ratio profiles, and reduce the environmental impact of the etching process. It is applied in memory technologies for data-intensive AI applications, such as NAND flash memory.

ALTUS product series: The nucleation layer is formed by the pulsed nucleation layer ALD process and in-situ bulk CVD filling is achieved through a multi-station sequential deposition architecture. It is used in advanced 3D NAND and DRAM, which can reduce the total resistivity of tungsten films, decrease the thickness and change the growth of CVD bulk filled grains.

Market position: It is one of the global giants in semiconductor wafer manufacturing equipment, holding a significant market share in the semiconductor deposition and etching fields. For instance, its market share in deposition is approximately 17%, and that in etching is about 39%. The two together contribute approximately 60% of the revenue. It ranked 237th on the Fortune 500 list of the United States in 2024.

Revenue situation: Achieved revenue of 17.43 billion US dollars in fiscal year 2023, representing a year-on-year growth of 1%. GAAP net profit reached 4.511 billion US dollars, a year-on-year decline of 2%. In the revenue composition for the third quarter of fiscal year 2024, the storage business accounted for 44%, foundry manufacturing 44%, logic components and others 12%, and by region, the Chinese mainland contributed 42% of the revenue.

Hot Module

LAM 08340205

LAM 09100039

LAM 810-006490-006

LAM 810-028296-173

LAM 810-028296-174

LAM 810-047858-101

LAM 810-072687-119

LAM 810-072687-120

LAM 810-072687-444

LAM 810-072907-005

LAM 810-072907-005

LAM 810-073479-003

LAM 810-082745-003

LAM 810-099175-103

LAM 810-102361R216

LAM 810-141735-006

LAM 810-209684-004

LAM 810-253279-102

LAM 810-267520-003

LAM 810-267520-003

LAM 810-311264-003

LAM 810-316271-503

LAM 810-327754-003

LAM 810-327754-003

LAM 810-335630-402

LAM 810-800081-016

LAM 810-800082-021

LAM 810-800082-029

LAM 810-800082-201

LAM 810-800082-243

LAM 810-800082-243

LAM 810-800082-309

LAM 810-802901-307

LAM 810-802902-006

LAM 810-802902-033

LAM 810-802902-034

LAM 810-802902-035

LAM 810-802902-208

LAM 853-312741-001

LAM 853-312741-001

LAM 810-802901-004

LAM 0100-03974

LAM 0100-04221W

LAM 332-000474-000

LAM 504722-09301324

LAM 605-064676-003

LAM 605-064676-003

LAM 605-109114-002

LAM 810-013872-108

LAM 810-028295-170

LAM 810-028296-160

LAM 810-048219-015

LAM 810-073479-005

LAM 810-328372-007

LAM 810-335630-402

LAM 810-800082-309

LAM 810-800082-311

LAM 810-800256-107

LAM 810-802902-033

LAM 810-802902-035

LAM 605-064676-003

LAM 605-109114-002

LAM 810-002895-102

LAM 810-017075-013

LAM 810-019566-705

LAM 810-048219-004

LAM 810-072687-120

LAM 810-072687-120

LAM 810-072687-120

LAM 810-102361R216

LAM 810-102361R222

LAM 810-115965-005

LAM 810-234640-215

LAM 810-240888-002

LAM 810-267520-003

LAM 810-267520-003

LAM 810-327754-003

LAM 810-328372-006

LAM 810-328372-007

LAM 810-335630-402

LAM 810-335630-402

LAM 810-800081-016

LAM 810-800081-016

LAM 810-800081-022

LAM 810-800082-310

LAM 810-800086-010

LAM 810-801237-005

LAM 810-802901-307

LAM 810-802902-005

LAM 810-802902-005

LAM 810-802902-033

LAM 810-802902-034

LAM 810-802902-035

LAM 810-802902-035

LAM 810-802902-038

LAM 810-802902-208

LAM 810-028295-161

LAM 810-028295-173

LAM 810-028295-174

LAM 810-028296-160

LAM 810-028296-171

LAM 810-028296-173

LAM 810-028296-174

LAM 810-210775-002

LAM 810-225831-001

LAM 810-267520-003

LAM 810-328372-006

LAM 810-328372-007

LAM 810-328372-007

LAM 810-335630-402

LAM 810-495659-304

LAM 810-495659-400

LAM 810-495659-410

LAM 810-495659-471

LAM 810-495659R006

LAM 810-495659R471

LAM 810-800031-352

LAM 810-800081-016

LAM 810-800082-310

LAM 810-A38647-101

LAM 810-001489-003

LAM 810-002885-102

LAM 810-002895-102

LAM 810-028295-174

LAM 810-028296-174

LAM 810-072687-111

LAM 810-072907-005

LAM 810-099175-001

LAM 810-102361-216

LAM 810-115985-005

LAM 810-234640-213

LAM 810-267520-003

LAM 810-311312-100

LAM 810-328372-001

LAM 810-328372-002

LAM 810-328372-007

LAM 810-335630-402

LAM 810-335630-402

LAM 810-800082-043

LAM 810-800082-201

LAM 810-800082-206

LAM 810-800082-308

LAM 810-800082-309

LAM 810-800082-309

LAM 810-802801-004

LAM 810-802901-307

LAM 810-802902-005

LAM 810-802902-019

LAM 810-802902-034

LAM 810-802902-035

LAM 810-802902-208

LAM 810-A0963-002

LAM 856-A28077-400

LAM 6004-0100-12

LAM 605-064676-003

LAM 710-800082-005

LAM 76-380322-00

LAM 810-001489-003

LAM 810-048219-025

LAM 810-072687-120

LAM 810-085439-002

LAM 810-102361R216

LAM 810-115965-005

LAM 810-129450-001

LAM 810-135227-011

LAM 810-146798-116

LAM 810-210775-002

LAM 810-225630-402

LAM 810-253279-102

LAM 810-267520-003

LAM 810-275725-002

LAM 810-308158-005

LAM 810-328372-002

LAM 810-335630-402

LAM 810-335630-402

LAM 810-800031-352

LAM 810-800081-016

LAM 810-800082-043

LAM 810-800082-309

LAM 810-800256-207

LAM 810-801237-101

LAM 810-802901-307

LAM 810-802902-017

LAM 810-802902-017

LAM 810-802902-019

LAM 810-802902-033

LAM 810-802902-035

LAM 810-802902-038

LAM 810-802902-208

LAM 853-312741-001

LAM 710-073479-005

LAM 810-028295-174

LAM 810-047858-101

LAM 810-049000-120

LAM 810-049439-203

LAM 810-049439-203

LAM 810-068158-015

LAM 810-069751-213

LAM 810-072687-120

LAM 810-082745R003

LAM 810-105035-201

LAM 810-135227-011

LAM 810-141734

LAM 810-141734-005

LAM 810-141735-006

LAM 810-141736-005

LAM 810-234640-214

LAM 810-234640-312

LAM 810-240888-002

LAM 810-240888-002

LAM 810-311312-002

LAM 810-328372-007

LAM 810-341810-101

LAM 810-495659-410

LAM 810-800082-041

LAM 810-800082-143

LAM 810-800082-243

LAM 810-800082-243

LAM 810-800256-207

LAM 810-801237-023

LAM 810-810193-003

LAM 853-235008-001

Contact Us